Hidden bonding system

Details Hidden bonding system Hidden bonding system

B - Operations, Transporting

23

K

B23K 1/00 (2006.01)

Patent

CA 2111419

A hidden bonding system includes a bonding member for bonding of adjacent surfaces. The bonding member itself comprises a meltable portion and extended electrically conductive leads to the meltable portion. These leads enable remote power to be applied to the meltable portion and after melting are removable from the meltable portion of the bonding member. The system further includes a power tool for affecting melting of the bonding member.

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