Hidden surface laser shock processing

C - Chemistry – Metallurgy – 21 – D

Patent

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Details

C21D 1/09 (2006.01) B23K 26/06 (2006.01)

Patent

CA 2226451

The invention includes a laser processing method for processing a hidden surface of a workpiece, the hidden surface disposed within a recess having an opening. The method comprises inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface.

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