High-adhesion moisture-curing hot-melt adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C09J 167/02 (2006.01)

Patent

CA 2688711

The present invention relates to the use of polyesters based on dicarboxylic acids with an uneven number of carbon atoms and on polyols with an uneven number of carbon atoms as adhesives or in adhesives. The present invention further provides adhesives comprising the stated polyesters, and their use for the production of adhesive bonds.

La présente invention concerne l'utilisation de polyesters à base d'acides dicarboxyliques ayant un nombre impair de carbones et de polyols ayant un nombre impair de carbones en tant qu'adhésif ou dans des adhésifs. La présente invention concerne également des adhésifs qui contiennent les polyesters mentionnés et leur utilisation pour la fabrication de liaisons.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

High-adhesion moisture-curing hot-melt adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-adhesion moisture-curing hot-melt adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-adhesion moisture-curing hot-melt adhesive will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1854867

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.