High capacitance multilayer bus bar and method of...

Details High capacitance multilayer bus bar and method of... High capacitance multilayer bus bar and method of...

H - Electricity

01

B

26/129, 337/30

H01B 5/14 (2006.01) H01B 7/00 (2006.01) H02G 5/00 (2006.01) H05K 1/02 (2006.01) H05K 1/16 (2006.01)

Patent

CA 1146641

-16- HIGH CAPACITANCE MULTILAYER BUS BAR AND METHOD OF MANUFACTURE THEREOF Abstract of the Disclosure A high capacitance bus bar is presented having at least two separated conductive plates between which a plurality of capacitive ceramic dielectric chips are positioned and adhered. The outer surfaces of the dielectric chips are metalized and have a roughened or coarse finish to provide contact between the di- electric chips and the conductive plates, thereby per- mitting use of nonconductive adhesive to bond the parts of the assembly together.

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