High density 3-d integrated circuit package

Details High density 3-d integrated circuit package High density 3-d integrated circuit package

H - Electricity

01

L

H01L 25/065 (2006.01) H01L 23/02 (2006.01) H01L 23/06 (2006.01) H01L 25/04 (2006.01) H01L 25/07 (2006.01) H01L 25/10 (2006.01) H01L 25/18 (2006.01) H05K 1/14 (2006.01) H05K 7/02 (2006.01)

Patent

CA 2474070

A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.

La présente invention concerne un boîtier de circuit dans lequel est créée un fichier à encoches par la connexion de deux parois latérales et une paroi de fond. Les parois latérales présentent des rainures gravées directement en regard l'une de l'autre. La plaquette comporte des brides qui s'encastrent dans les rainures. Dans un mode de réalisation, un cube est entièrement formé lorsque les plaquettes remplissent le fichier à encoches.

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