High density bi-level card edge connector and method for...

Details High density bi-level card edge connector and method for... High density bi-level card edge connector and method for...

H - Electricity

01

R

339/10.7

H01R 13/00 (2006.01) H01R 43/16 (2006.01) H01R 43/18 (2006.01)

Patent

CA 2039757

An electrical connector of the card edge connector type having a housing, two types of contacts and a contact separator. AT least two contacts are located in the same contact chamber in the housing with the separator keeping the contacts separate. In an alternate embodiment, the connector has two housings. Each housing has a contact therein and one housing is mounted inside the other housing. The connector can also comprise a signal transmitting section and a power transmitting section formed from modular units that are connected together at their ends.

Affiliated with

Also associated with

Rating

High density bi-level card edge connector and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density bi-level card edge connector and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density bi-level card edge connector and method for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1938042