High density composite material

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

C08K 13/04 (2006.01) C08K 3/08 (2006.01) C08K 7/02 (2006.01) C22C 32/00 (2006.01) C22C 47/14 (2006.01) C22C 49/00 (2006.01) C22C 49/14 (2006.01) F42B 12/74 (2006.01) G21F 1/10 (2006.01)

Patent

CA 2259308

The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.

Cette invention concerne une famille de matériaux pouvant remplacer le plomb dans des applications où la forte densité du plomb est importante, mais où sa toxicité est indésirable. La présente invention concerne plus particulièrement un matériau de forte densité constitué de tungstène, de fibre et d'un liant. L'invention porte aussi sur des procédés, compositions et applications relatifs auxdits matériaux.

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