High density connector and method of manufacture

Details High density connector and method of manufacture High density connector and method of manufacture

H - Electricity

01

R

H01R 13/02 (2006.01) H01R 13/40 (2006.01)

Patent

CA 2455080

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. In one embodiment, a connector assembly includes a substrate having a major surface and a conductive element. A surface mount electrical connector is adapted to be mounted on the major surface of the substrate. The connector includes a contact having a connector portion adapted to be located a distance from the major surface and a body of reflowable, electrically conductive material disposed on the connector portion and adapted to engage the conductive element so that the body provides the primary electrical current path between the connector and the substrate.

Affiliated with

Also associated with

Rating

High density connector and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density connector and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connector and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1402863