High density connector arrangement for a circuit board module

H - Electricity – 01 – R

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01R 13/631 (2006.01) H05K 1/11 (2006.01) H05K 1/14 (2006.01) H01R 12/14 (2006.01)

Patent

CA 2248712

A circuit board module includes a plurality of high density edge connectors (11, 12) in which the contacts are arranged in rows, with contact tails (13) extending from the connectors (11, 12) for electrical connection to a circuit board (8, 9) carrying electrical components. Instead of terminating the contacts directly to pads or terminals on the principal surface of the circuit board on which the electrical components are situated, the contact tails are terminated to pads or terminals on pairs of intermediate circuit boards (14, 15) each providing two termination surfaces rather than one, thereby effectively doubling the space available for termination. The intermediate circuit boards (14, 15) are connected to the main circuit board (8, 9) by a rigid-flex interconnection,(16, 17) thus facilitating assembly of the connectors to a heat sink (10) or frame of the circuit board following termination of the contact tails to the intermediate circuit boards.

Ce module pour cartes imprimées comprend une pluralité de connecteurs latéraux (11, 12) haute densité présentant des contacts disposés en rangées, des queues de contact (13) s'étendant à partir des connecteurs (11, 12), afin de permettre la connexion électrique de cette carte imprimée (8, 9) portant des composants électriques. Au lieu de raccorder les contacts directement à des plages de connexion ou bornes disposées sur la surface principale de la carte imprimée sur laquelle sont disposés les contacts électriques, on raccorde les queues de contact aux plages de connexion ou bornes situées sur des paires de cartes imprimées intermédiaires (14, 15), ces cartes intermédiaires fournissant chacune deux surfaces de connexion au lieu d'une, doublant ainsi de manière efficace l'espace disponible servant au raccordement des contacts. Les cartes intermédiaires (14, 15) sont connectées à la carte principale (8, 9) au moyen d'une interconnexion flex-rigide (16, 17), ce qui facilite l'assemblage des connecteurs à un puits de chaleur (10) ou sur le cadre d'une carte imprimée, après raccordement des queues de contact avec les cartes intermédiaires.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

High density connector arrangement for a circuit board module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density connector arrangement for a circuit board module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density connector arrangement for a circuit board module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1607797

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.