High density, controlled impedance connector

Details High density, controlled impedance connector High density, controlled impedance connector

H - Electricity

01

R

339/7.1

H01R 13/72 (2006.01) H01R 13/658 (2006.01) H01R 12/16 (2006.01)

Patent

CA 1244531

HIGH DENSITY, CONTROLLED IMPEDANCE CONNECTOR ABSTRACT A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while moutning a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.

493753

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