High density corrugated wafer board panel product

Details High density corrugated wafer board panel product High density corrugated wafer board panel product

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B27D 1/08 (2006.01) B27N 3/06 (2006.01) B27N 5/00 (2006.01) B32B 21/02 (2006.01)

Patent

CA 1275620

"HIGH DENSITY CORRUGATED WAFER BOARD PANEL PRODUCT" ABSTRACT OF THE DISCLOSURE A 'high density' corrugated wafer board panel is provided. The wafer board panel has a substantially uniform density ranging from between about 700 kg/m3 to 900 kg/m3. As a result of increasing the density of the panel without changing the panel weight per projected unit area, a panel having improved overall flexure performance properties is provided.

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