H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/14 (2006.01) H05K 1/14 (2006.01)
Patent
CA 2300575
Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.
Durston Andrew Colin
Hwang Liang
Rodriguez Hector Francisco
Kirby Eades Gale Baker
Lucent Technologies Inc.
LandOfFree
High density cross-connection system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density cross-connection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density cross-connection system will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1463107