High density electrical interconnect for a continuous ink...

Details High density electrical interconnect for a continuous ink... High density electrical interconnect for a continuous ink...

B - Operations, Transporting

41

J

B41J 2/02 (2006.01) B41J 2/01 (2006.01) B41J 2/03 (2006.01) H01R 13/629 (2006.01)

Patent

CA 2292082

Recognizing the need for longer ink jet arrays with higher print densities and the concurrent need for minimal overall size of the printhead, the present invention proposes a system and method for establishing a high-density electrical interconnection between high-voltage driver chips and charging electrodes controlled by the driver chips. A charge plate has a charging electrode density on its face, and an associated mating circuit. Alignment features are then provided on the charge plate and/or the mating circuit. The alignment features of the charge plate and the mating circuit are mechanically engaged to ensure alignment of mating contact pads. And an interconnect is provided for the aligned mating contact pads.

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