H - Electricity – 01 – L
Patent
H - Electricity
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H01L 21/84 (2006.01) A61B 3/113 (2006.01) G02B 27/00 (2006.01) G02F 1/1362 (2006.01) H01L 21/822 (2006.01) H01L 21/98 (2006.01) H01L 25/10 (2006.01) H01L 27/06 (2006.01) H01L 27/12 (2006.01) H01L 29/786 (2006.01) G02B 5/30 (2006.01) G02F 1/1333 (2006.01) H01L 27/15 (2006.01) H01L 21/90 (1990.01)
Patent
CA 2129123
2129123 9316491 PCTABS00025 The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.
Cheong Ngwe
Dingle Brenda
Jacobsen Jeffrey
Salerno Jack P.
Spitzer Mark B.
Kopin Corporation
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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