High density integrated circuits and method of packaging the...

Details High density integrated circuits and method of packaging the... High density integrated circuits and method of packaging the...

H - Electricity

01

L

H01L 23/50 (2006.01)

Patent

CA 2192734

A method of increasing the packaging density of input/output interconnections between the semiconductor chip and substrate is described. Fine insulated wire is utilized for the connections to bonding pads provided selectively on the semiconductor chip without limiting to locating them along the periphery of the chip. The connections are made easily and quickly with the ball bonding process.

Méthode permettant d'augmenter la densité d'intégration d'entrée/sortie entre une puce de semiconducteur et un substrat. Un fil fin isolé est utilisé pour établir les connexions sur les pastilles de connexion à des endroits sélectionnés sur la puce de semiconducteur plutôt qu'uniquement sur la périphérie de la puce. Les connexions s'effectuent facilement et rapidement grâce à un procédé de soudage par boule.

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