B - Operations – Transporting – 41 – J
Patent
B - Operations, Transporting
41
J
B41J 2/01 (2006.01) B41J 2/14 (2006.01)
Patent
CA 2115893
HIGH DENSITY INTERCONNECT APPARATUS FOR AN INK JET PRINTHEAD ABSTRACT OF THE DISCLOSURE The body of a piezoelectrically operable ink jet printhead is mounted in an upper side surface groove formed in a mounting plate member. A rear bottom section of the printhead body has an exposed top side surface portion which is flush with the top side of the mounting plate member and terminates forwardly of its rear end. A high density parallel array of mutually spaced linear conductive traces is formed on this exposed top side surface portion of the printhead body, these traces being used to transmit electrical operating signals from a separate electronic driver to piezoelectrically drivable channel sidewall sections within the interior of the printhead body. A multi- tiered printed circuit board secured to the top side of the mounting plate member is used to connect the printhead to the electronic driver. The circuit board has a series of linear traces formed on its bottom side which register with and are soldered to the closely spaced printhead body traces, a spaced series of lower density spacing contact pads formed on its top side and releasably engageable with correspondingly spaced contact pads on the electronic driver, and internal crossover circuitry that operatively connects the high density underside linear traces of the circuit board to its lower density top side contact pads.
Compaq Computer Corporation
Finlayson & Singlehurst
LandOfFree
High density interconnect apparatus for an inkjet printhead does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density interconnect apparatus for an inkjet printhead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density interconnect apparatus for an inkjet printhead will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1529719