High density lsi package for logic circuits

Details High density lsi package for logic circuits High density lsi package for logic circuits

H - Electricity

01

L

356/21, 347/35

H01L 23/04 (2006.01) H01L 23/055 (2006.01) H01L 23/48 (2006.01) H01L 23/498 (2006.01) H01L 23/52 (2006.01) H01L 23/538 (2006.01) H01L 25/10 (2006.01)

Patent

CA 1229155

ABSTRACT OF THE DISCLOSURE A multi-chip package includes a novel leafless multi-chip carrier which has bonding pads for bonding the leads of IC chips mounted on the upper surface of the carrier. Terminal pads are formed on the under surface of the carrier and are arranged in a grid form for connection to a substrate which is provided with connective wiring for connecting the bonding pads to each other and to the terminal pads with via-hole wiring. A cover is provided for covering either the upper surface or all the four side surfaces of the substrate, stuck to either or both of the upper surface and four side surfaces. Also provided are IC chips having leads each bonded to one of the bonding pads on the upper surface of the substrate, the bodies of the chips being struck to the inside of the cover.

450758

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