High density stacked circuit module

Details High density stacked circuit module High density stacked circuit module

H - Electricity

05

K

H05K 7/00 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 7/02 (2006.01)

Patent

CA 2266980

A high density circuit module construction uses a flex circuit attached to a substrate and folded over on it to provide higher packaging density while providing an increase in the surface area available for I/O pads. A substrate has components such as ICs mounted on one surface, and module I/O pads on the opposite surface. This surface also provides interconnects for the flex circuit. The flex circuit has one portion attached to the interconnect pads on one surface of the substrate. Another portion of the flex circuit folds around the substrate and is attached to the other side of the substrate. The surface area of this portion of the flex circuit provides an additional surface area for mounting circuit components, within essentially the same footprint area as the substrate. This module construction provides a higher density than prior art constructions, while providing a larger, unobstructed area for the I/O pads, which simplifies connecting the module into a larger assembly.

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