High density substrate and methods for manufacturing same

Details High density substrate and methods for manufacturing same High density substrate and methods for manufacturing same

H - Electricity

05

K

H05K 3/02 (2006.01)

Patent

CA 2374863

This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits, interposers, and other electronic laminates.

L'invention concerne des substrats munis d'une couche métallique ultra-mince, qu'on utilise pour fabriquer des circuits à haute densité. Elle concerne de nouveaux procédés mettant en oeuvre ces substrats pour fabriquer des stratifiés, des circuits, des interposeurs et autres stratifiés électroniques.

Affiliated with

Also associated with

Rating

High density substrate and methods for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density substrate and methods for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density substrate and methods for manufacturing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1637457