High density, three-dimensional, intercoupled circuit structure

Details High density, three-dimensional, intercoupled circuit structure High density, three-dimensional, intercoupled circuit structure

H - Electricity

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H01L 25/065 (2006.01) G02B 6/12 (2006.01) G02B 6/42 (2006.01) G02B 6/43 (2006.01) H01L 23/13 (2006.01) H01L 23/473 (2006.01) H01L 23/538 (2006.01) H01L 23/64 (2006.01) H01L 25/10 (2006.01) H01L 25/16 (2006.01)

Patent

CA 2094234

A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.

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