G - Physics – 11 – C
Patent
G - Physics
11
C
352/82.4
G11C 11/24 (2006.01) G11C 11/34 (2006.01) G11C 11/404 (2006.01) H01L 27/10 (2006.01) H01L 27/108 (2006.01)
Patent
CA 1277031
Abstract HIGH DENSITY VERTICALLY STRUCTURED MEMORY A dynamic random access memory is provided wherein each cell has a storage capacitor and switching device and a bit/sense line or plate located along a sidewall of a trench formed in a semiconductor substrate. In a more particular structure of the cell, the trench width defines the length of the switching device, with the storage capacitor and a highly conductive bit/sense line being formed along opposite sidewalls of the trench. In an array of such cells, the highly conductive bit/sense line or plate interconnecting a large number of the cells of the array extends continuously from cell to cell within the trench at a sidewall thereof. Likewise, the storage capacitors of these many cells have a highly conductive common plate extending continuously within the trench at the opposite sidewall. BU-9-85-004
534688
Fitzgerald Brian F.
Nguyen Kim Y.t.
Nguyen Son V.
International Business Machines Corporation
Na
LandOfFree
High density vertically structured memory does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density vertically structured memory, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density vertically structured memory will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1204270