F - Mech Eng,Light,Heat,Weapons – 25 – B
Patent
F - Mech Eng,Light,Heat,Weapons
25
B
F25B 21/02 (2006.01) H01L 35/00 (2006.01)
Patent
CA 2682442
A high efficiency thermoelectric cooling system and method is described. The cooling system comprises a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A power supply having converter circuit means provides a smooth continuous variable output direct current supply to the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. One of the plates is a cold plate and the other a hot plate caused by current flow in the semi-conductor body transferring heat from the cold plate to the hot plate. A cold heat sink is associated with the cold plate to absorb heat from the insulted enclosure to cool the enclosure. A heat convection assembly including a hot heat sink evacuates heat from the hot plate to effectively manage the temperature differential across the plates. A mounting assembly is adapted to secure the thermoelectric cooling device to a wall of the insulated enclosure with the heat convection means disposed exteriorly of the insulated enclosure. An air convection housing may b provided to evacuate heat from the hot heat sink using an outside air supply or ambient air supply and using fans and gates to displace and channel the air flow.
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
Pinet Claude
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