High energy radiation curable resist and preparatory process

Details High energy radiation curable resist and preparatory process High energy radiation curable resist and preparatory process

H - Electricity

01

L

356/1, 31/154, 3

H01L 21/00 (2006.01) G03F 7/038 (2006.01)

Patent

CA 1088737

Abstract of the Disclosure Negative resist compositions are based on carbonaceous polymers with substituent branches containing epoxy groupings. Inclusion of halogenated aryl groundings in the polymers results in stabilization with respect to ionizing radiation used for dry processing following lithographic development--e.g., ion milling. Halogenation is responsible for retention of sensitivity to deli?eating radiation--e.g., e-beam, e-flood, X-ray. Lithographic qualities are such that exemplary members are promising for large-scale integration direct processing.

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