High-frequency circuit and its module for communication devices

H - Electricity – 03 – H

Patent

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Details

H03H 1/00 (2006.01) G02F 1/01 (2006.01) H01L 23/48 (2006.01) H01L 23/66 (2006.01) H01S 5/026 (2006.01) H03H 7/00 (2006.01) H04B 10/04 (2006.01) H04B 10/145 (2006.01)

Patent

CA 2345175

A high-frequency circuit is provided, which makes it possible to prevent degradation of its high-frequency characteristic even if the lengths of bonding wires used are not decreased. This circuit comprises: (a) an electronic element having a capacitance; (b) a signal line for transmitting a high-frequency electric signal to the element; (c) a terminating resistor for impedance matching; (d) a first bonding wire for electrically connecting the signal line and the element; and (e) a second bonding wire for electrically connecting the element and the resistor. A characteristic impedance of combination of the element and the first and second bonding wires is equal to or greater than that of input side of the electric signal with respect to the combination. An inductance of the second wire is greater than that of the first wire. Preferably, at least one of the lengths of the first and second bonding wires is decreased, which enhances the advantage of the high-frequency circuit.

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