High-frequency circuit device

H - Electricity – 01 – L

Patent

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356/79

H01L 23/52 (2006.01)

Patent

CA 1196109

ABSTRACT OF THE DISCLOSURE, A high-frequency circuit device composed of hybrid ICs, comprises an insulated substrate, an active component fabricated on the insulated substrate and including a ground terminal for grounding high frequency signal components, a first electrode fabricated on one surface of the insulated substrate and connected to the ground terminal, a ground conductor on the insulated substrate, a dielectric body placed on the ground conductor, a second electrode fabricated on an opposite surface of the insulated substrate in confronting relation to the ground conductor across the dielectric body and connected to the first electrode through a through hole defined in the insulated substrate, the ground terminal of the active component connected to ground high-frequency signal components through the first electrode, the through hole, the electrode, the dielectric body, and the ground conductor.

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