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Patent
CA 2165334
A high-frequency wireless communication system on a single ultrathin silicon on sapphire chip is presented. This system incorporates analog, digital (logic and memory) and high radio frequency circuits on a single ultrathin silicon on sapphire chip. The devices are fabricated using conventional bulk silicon CMOS processing techniques. Advantages include single chip architecture, superior high frequency performance, low power consumption and cost effective fabrication.
L'invention concerne un système de communications sans fil à haute fréquence sur une microplaquette ultramince de silicium sur saphir. Ce système comporte des circuits analogiques, numériques (logique et mémoire) et des circuits pour hautes fréquences radio sur une seule microplaquette ultramince de silicium sur saphir. Les dispositifs sont fabriqués en utilisant des techniques de fabrication des circuits CMOS sur silicium. Parmi les avantages, on peut citer une architecture de microplaquette unique, un rendement amélioré à haute fréquence, une consommation faible en énergie et des coûts de fabrication bas.
Burgener Mark L.
Reedy Ronald E.
Gowling Lafleur Henderson Llp
Peregrine Semiconductor Corporation
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