B - Operations – Transporting – 24 – D
Patent
B - Operations, Transporting
24
D
57/16
B24D 3/16 (2006.01)
Patent
CA 1285776
Abstract of Disclosure Herein is disclosed a high hardness sintered diamond compact and a process for the production of the same. The high hardness sintered diamond compact comprises 80 to 95% by volume of diamond particles, 0.5 to 5% by volume of a carbide particles selected from a group consisting of WC and (Mo,W)C and having a diameter not larger than 1 micron, and 4.5 to 15% by volume of an iron group metal, at least 95% by volume of said diamond particles having a diameter from 0.1 to 2 micron and the remainder of the diamond particles being particles having a diameter smaller than 0.1 micron. The ratio by volume of the amount of the diamond particles having a diameter from 1 to 2 micron to that of the diamond particles having a diameter from 0.1 to 1 micron ranges from 4 to 1. The high hardness sintered diamond compact according to the present invention is preferably usable as a drawing die for drawing a high hardness plated-steel wire and as a tool bit. The process according to the invention, comprises the steps of: preparing a diamond powder having a particle diameter distribution from 0.2 to 2 micron; mixing the diamond powder with an iron group metal and one member selected from the group consisting of WC and (Mo,W)C powders each having a particle diameter not larger than 1 micron; hot-pressing the thus obtained mixture of powders at an ultra-high pressure and a high temperature where diamond may be stable.
468347
Asai Keizo
Kumazawa Yoshiaki
Nakai Tetsuo
Yazu Syuzi
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
Sumitomo Electric Industries Ltd.
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