High impact polyamides

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/5811

C08L 77/00 (2006.01) C08G 69/02 (2006.01) C08G 69/34 (2006.01) C08K 5/17 (2006.01) C08L 47/00 (2006.01)

Patent

CA 1080879

Abstract of the Disclosure A high impact polyamide resin is prepared by interpoly- merizing with polyamide forming monomers a minor amount of an approximately equi-molar mixture of a low molecular weight diolefin polymer, and a dimerized fat acid or acid derivative, said diolefin polymer and dimerized fat acid or derivative having terminal amide-forming functional groups at each end of the polymer chain. The product has extremely high impact strength and may be used as a molding or extrusion material in those applications where mechanical strength, toughness and durability are prerequisites.

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