C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 51/04 (2006.01) C08L 25/06 (2006.01) C08L 53/02 (2006.01) C08L 71/12 (2006.01)
Patent
CA 2050526
O.Z. 0050/41887 Abstract of the Disclosure: The molding composition comprises, based on the sum total of A, B, C and D, A: not less than 5 % by weight of a polyphenylene ether A B: not less than 5 % by weight of an impact modified polystyrene B C: 1 - 20 % by weight of a block copolymer C of styrene and a conjugated diene D: 1 - 20 % by weight of a copolymer D obtained by grafting styrene onto an EPDM rubber.
Feldmann Heike
Muehlbach Klaus
Seitz Friedrich
Zeltner Doris
Basf Aktiengesellschaft
Robic
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