High moduli polyimides

Details High moduli polyimides High moduli polyimides

C - Chemistry, Metallurgy

08

G

C08G 73/10 (2006.01) C08G 73/14 (2006.01)

Patent

CA 2056876

Improved imide-containing copolymers comprising, in the aromatic diamine component, p-phenylene diamine and at least one additional aromatic diamine have increased rigidity and useful processability. The copolymers of this invention also may exhibit improved resistance to the detrimental effects of humid environments and retain mechanical properties at elevated temperatures after exposure to humid environments.

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