C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5002
C08L 67/00 (2006.01) C08G 18/08 (2006.01) C08G 63/06 (2006.01) C08G 63/19 (2006.01) C08G 63/79 (2006.01) C08L 67/03 (2006.01) C08L 77/00 (2006.01)
Patent
CA 2036641
Abstract of the Disclosure HIGH MODULUS POLYMERIC COMPOSITION The present invention discloses a process for preparing polymeric compositions which exhibit high modulus and high impact strength. The techniques of this invention can be utilized to improve the modulus and impact strength of virtually any type of thermoplastic resin or thermosetting resin. The subject invention specifically relates to a process for preparing a high modulus polymeric composition which comprises: (1) polymerizing at least one diacid or diacid halide with at least one member selected from the group consisting of diols and diamines in a solution of a thermoplastic resin or thermosetting resin under conditions which result in the formation of a solution of the thermoplastic resin or thermosetting resin having a polyester or a polyamide dispersed therein; and (2) recovering the high modulus polymeric composition from the solution. It is often desirable for the polyester or polyamide to be a liquid crystalline polyester or a liquid crystalline polyamide. It is also generally desirable for the high modulus polymeric composition to be prepared by interfacial polymerization. It is also possible to prepare polyamides or polyesters by polymerizing amino aromatic acids or hydroxy aromatic acids by a direct polycondensation reaction in the solution of a thermoplastic resin or thermosetting resin.
Callander Douglas D.
Cohn Gerald
Ogata Naoya
Smart & Biggar
The Goodyear Tire & Rubber Company
LandOfFree
High modulus polymeric composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High modulus polymeric composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High modulus polymeric composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2048097