High modulus prepregable epoxy resin systems

Details High modulus prepregable epoxy resin systems High modulus prepregable epoxy resin systems

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08G 59/50 (2006.01)

Patent

CA 2099193

ABSTRACT Compositions comprising epoxy resin containing at least one glycidyl group and aparticular aromatic amine hardener possess the necessary balance of properties required for making prepreg. 94,306

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