C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) B32B 27/38 (2006.01) C08L 83/08 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2049180
This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.
Decker Gary T.
Gornowicz Gerald A.
Tobukuro Kuniaki
Dow Corning Corporation
Gowling Lafleur Henderson Llp
Toray Industries Inc.
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