High molecular resin composition comprising polyphenylene...

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3040, 400/63

C08L 51/06 (2006.01) C08L 25/04 (2006.01) C08L 71/12 (2006.01)

Patent

CA 1137677

Abstract of the disclosure A high molecular resin composition having superior impact strength and processability and com- rising a polymeric matrix containing polyphenylene ether and a minor proportion of a low-molecular- weight olefin oligomer dispersed therein.

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