High molecular weight polycarbonates of...

C - Chemistry – Metallurgy – 08 – G

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402/174, 402/176

C08G 64/28 (2006.01) C08G 64/06 (2006.01)

Patent

CA 1051590

Abstract of the Disclosure The present invention is related to high molecular weight polycarbonates based on aromatic dihydroxy compounds which contain 5 to 100 mol % preferably 20 to 100 mol % of structural units derived from a,a,a,a',a',a'-hexaisaryl-1,3- and/or -1,4-dimethyl benzene dihydroxy compounds. In a preferred embodiment, the polycarbonate is a copolymer of the hexakisaryl dlhydroxy compounds and bisphenols known to be useful in producing polycarbonates. The residues of the hexaklsaryl compound may be 5 to 90 mol %, preferably 20 to 70 mol % of the structural units. An especially preferred copolymer is that between the hexakisaryl compounds and a,a'-(hydroxyphenyl)-diisopropyl benzenes. These polycar- bonates show improved heat stability and higher second order transition temperature points than conventional polycarbonates and are useful in applications involvlng high service tempe- ratures such as electrical insulating film.

226865

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