High performance epoxy adhesive composition with high...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 163/00 (2006.01) C08G 59/32 (2006.01) C09J 109/00 (2006.01) C09J 163/04 (2006.01) C09J 177/08 (2006.01)

Patent

CA 2075656

K-18754/A/CGC 1567 HIGH PERFORMANCE EPOXY ADHESIVE COMPOSITION WITH HIGH FLEXIBILITY AND TOUGHNESS Abstract The present invention relates to a two component epoxy resin adhesive system comprising: (A) an epoxy component comprising (a) at least one aromatic multifunctional epoxy resin, and (B) a liquid elastomer component comprising (a) a liquid copolymer based on butadiene and at least one ethylenically unsaturated comonomer, (b) a liquid oligomer reaction product of a polyamine and a dimer acid and (c) a liquid aromatic or aliphatic polyamine, which exhibits a combination of high glass transition temperature (Tg), flexibility, fast curing, chemical thixotropy, high temperature resistance and excellent adhesion.

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