High performance epoxy based laminating adhesive

Details High performance epoxy based laminating adhesive High performance epoxy based laminating adhesive

C - Chemistry, Metallurgy

08

L

154/141, 400/541

C08L 61/14 (2006.01) C08G 18/58 (2006.01) C08G 59/14 (2006.01) C08G 63/68 (2006.01) C08G 63/91 (2006.01) C08L 67/00 (2006.01) C09J 161/14 (2006.01) C09J 163/00 (2006.01) C09J 167/00 (2006.01) C09J 175/04 (2006.01) C09J 179/00 (2006.01)

Patent

CA 2004130

PATENT ABSTRACT A high performance laminating adhesive material is prepared using one or more epoxy components which inter- react with a high molecular weight polyester component through a two-stage reaction sequence. The first stage of the sequence is the reaction of a isocyanate component with a polyester component. The stage of the sequence is the reaction of the isocyanate/polyester component with the epoxy component(s). The result of the reaction process is an adhesive material providing a flexible, high temperature resistant, fully crosslinked adhesive with good Z-axis sta- bility without the evolution of by-products. The adhesive material has application to the bonding of polyimide films, copper or other metal foils and hardboards for use in the manufacture of flexible, hardboard or multilayer substrates as well as surface to surface bonding of other materials.

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