High performance integrated circuit semiconductor package...

Details High performance integrated circuit semiconductor package... High performance integrated circuit semiconductor package...

H - Electricity

05

K

356/1, 356/25

H05K 1/11 (2006.01) H01L 23/50 (2006.01) H01L 23/64 (2006.01)

Patent

CA 1090002

HIGH PERFORMANCE INTEGRATED CIRCUIT SEMICONDUCTOR PACKAGE AND METHOD OF MAKING Abstract of the Disclosure A high performance package for integrated circuit semi- conductor devices in which decoupling capacitors are provided in close proximity to the integrated circuit devices for reducing voltage variations in the power driver lines, and/ or a ground plate overlying the stripe metallurgy on the surface of the substrate for reducing cross-talk between signal lines. The decoupling capacitors are each comprised of a conductive layer on the inside of a via hole, a concentric dielectric layer on the conductive layer, and an electrically conductive plug in physical contact with the dielectric layer that is associated with the driver line circuitry of the package.

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