High performance semiconductor package assembly

Details High performance semiconductor package assembly High performance semiconductor package assembly

H - Electricity

05

K

356/10

H05K 1/14 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1143862

High Performance Semiconductor Package Assembly Abstract An improved high performance semiconductor package assembly for interconnecting a plurality of integrated circuit devices having a multilayer sub- strate with internal wiring including signal wiring and external signal and power connections, a plurality of integrated circuit semiconductor devices supported on the top surface of the substrate in electrically connected operative relation, the improvement being a power supply distribution system for providing electrical supply voltages to the devices from the power connections consisting of radial waveguide structure including parallel waveguide planes with a low input impedence to reduce switching noise, the waveguide planes located between the signal fan-out wiring and internal wiring metallurgy and connected in common to all of the plurality of devices.

365431

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