High performance solvent-free contact adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 157/00 (2006.01) C09J 11/08 (2006.01) C09J 123/08 (2006.01)

Patent

CA 2078476

An aqueous contact adhesive composition consisting essentially of a) an aqueous emulsion containing an adhesive polymer, b) 0-50 wt% plasticizer, based on polymer solids, c) 0.5-10 wt% thermoplastic hollow microspheres, based on polymer solids, and d) 0-4.5 wt% polyethylenimine, based on polymer solids, the adhesive composition demonstrating less than one pound per linear inch adhesion to stainless steel by PSTC-l method.

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