High-power diode laser and method for mounting the same

H - Electricity – 01 – S

Patent

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Details

H01S 5/40 (2006.01) H01S 5/02 (2006.01)

Patent

CA 2216487

The invention is directed to a high-power diode laser and to a method for mounting same. It is substantial to the invention to provide predetermined breaking locations in the laser bar which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.

L'invention est constituée par un laser à diode de grande puissance et par une méthode de montage de ce laser. Il est essentiel dans cette invention de créer des points de rupture prédéterminés dans le barreau laser qui, durant le refroidissement après le soudage du barreau laser à un dissipateur de chaleur à coefficient d'expansion thermique plus petit, provoquent des ruptures à des endroits prédéterminés entre les diodes laser individuelles du barreau. Comme résultat de la segmentation matérielle de ce barreau, il est possible d'utiliser une soudure à faible ductilité (soudure forte) à la température ambiante car la destruction des diodes laser individuelles sous l'effet de tensions mécaniques est exclue.

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