H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 33/48 (2010.01) H01L 33/62 (2010.01) H01L 33/64 (2010.01) F21L 4/00 (2006.01) F21V 5/04 (2006.01)
Patent
CA 2451808
A method and system are taught for a system comprising an LED package. The LED package may comprise a leadframe having an annular contact and a base contact. An LED die may be coupled to the annular and base contacts such that the P-type material portion is electrically connected to an annular contact and the N-type material portion is electrically connected to a base contact. Alternatively the N-type material portion may be electrically connected to the annular contact and the P-type material portion may be electrically connected to the base contact. A lens may be coupled to the leadframe, and an optical material may be located in a cavity defined by the lens, the base contact, and the annular contact. The optical material may be a gel, a grease, a resilient material, a non-resilient material, a rigid material, a liquid material or a non-liquid material. The method and system may further comprise a mounting device, wherein the LED package is mechanically coupled to the mounting device in a socket, bayonet, or threaded fashion. The method and system may further comprise a strip comprising an array of annular contacts utilized to form an array of the LED packages and a carrier strip comprising receiving devices to receive the array of LED packages. A portion of the lens may either be coated with or comprise light excitable material or the optical material may comprise light excitable material, such that the system emits white light.
Barnett Thomas J.
Tillinghast Sean P.
Gowling Lafleur Henderson Llp
Weldon Technologies Inc.
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