High pressure bonding process

Details High pressure bonding process High pressure bonding process

B - Operations, Transporting

23

K

26/109

B23K 20/00 (2006.01)

Patent

CA 1324485

ABSTRACT An improved bonding process comprises the steps of forming a first interim interface surface in a first body, the interface surface being selectively surrounded by portions of said first body, and forming a second exterior interface surface, the exterior interface surface selectively surrounding portions of the second body. The first and second bodies are assembled such that the first and second interfacing surfaces selectively contact each other. The dimensions of the first and second interface surfaces are selected such that pressure contact is maintained between them. The first and second bodies are subjected to a bonding cycle to form a bond along the first and second interface surfaces.

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