High pressure processing chamber for multiple semiconductor...

H - Electricity – 01 – L

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H01L 21/00 (2006.01) B08B 7/00 (2006.01) H01L 21/673 (2006.01)

Patent

CA 2462429

A high pressure processing chamber for processing multiple semiconductor substrates I comprises a chamber housing, a cassette, and a chamber closure. The cassette is removably coupled to the chamber housing. The cassette is configured to accommodate at least two semiconductor substrates. The chamber closure is coupled to the chamber housing. The chamber closure is configured such that in operation the chamber closure seals with the chamber housing to provide an enclosure for high pressure processing of the semicon ductor substrates.

L'invention concerne une chambre de traitement à haute pression servant à traiter de multiples substrats semi-conducteurs. La chambre de traitement selon l'invention comprend une enveloppe de chambre, une cassette et une fermeture de chambre. La cassette est couplée de manière détachable à l'enveloppe de chambre et est réalisée de manière à recevoir au moins deux substrats semi-conducteurs. La fermeture de chambre est couplée à l'enveloppe de chambre et est réalisée de façon à fermer hermétiquement l'enveloppe de chambre en fonctionnement, fournissant ainsi une enceinte pour le traitement à haute pression des substrats semi-conducteurs.

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