High profile shrink package

Details High profile shrink package High profile shrink package

B - Operations, Transporting

65

B

156/7

B65B 11/52 (2006.01) B65B 11/50 (2006.01) B65B 11/58 (2006.01) B65B 31/02 (2006.01)

Patent

CA 1313120

ABSTRACT OF THE DISCLOSURE The present invention involves a method of packaging a product. including drawing a thermoplastic thermoformable web into a thermoforming mold to form a cavity, inserting the product into the cavity, moving the web and product to a vacuum chamber, placing a tray, upside down, in the chamber on top of the web to define an unsealed package; soaling the tray to the web under vacuum; and shrinking the bottom web.

614692

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