H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H01L 21/48 (2006.01)
Patent
CA 2539280
A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
L'invention concerne un substrat pour circuit multicouche pour des modules multipuces ou des circuits hybrides. Le substrat décrit dans cette invention comprend un substrat de base diélectrique, des conducteurs formés sur le substrat de base et un film mince diélectrique déposé par évaporation sous vide par dessus les conducteurs et le substrat de base. Ledit film mince est imprimé au moyen de structures sacrificielles forées par des techniques de masquage par masque perforé. Les substrats ainsi formés permettant d'augmenter significativement la densité d'interconnexion et de réduire significativement l'épaisseur globale du substrat.
Pendo Shaun
Shah Rajiv
Medtronic Minimed Inc.
Oyen Wiggs Green & Mutala Llp
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