High sensitivity resist system with separably developable...

Details High sensitivity resist system with separably developable... High sensitivity resist system with separably developable...

B - Operations, Transporting

05

D

96/185

B05D 3/06 (2006.01) G03F 7/039 (2006.01) G03F 7/095 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1071455

HIGH SENSITIVITY RESIST SYSTEM FOR LIFT-OFF METALLIZATION Abstract of the Disclosure High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutually exclusive of one another. The resist can operate for lift-off at electron beam exposure equal to or greater than 5x10-6 coulombs/cm2.

267433

Affiliated with

Also associated with

Rating

High sensitivity resist system with separably developable... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High sensitivity resist system with separably developable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High sensitivity resist system with separably developable... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-466885