High shrink energy/high modulus thermoplastic multi-layer...

B - Operations – Transporting – 32 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

154/140, 220/2,

B32B 27/08 (2006.01) B29C 47/04 (2006.01) B29C 55/02 (2006.01) B29C 61/06 (2006.01) B32B 27/16 (2006.01) B65D 75/00 (2006.01) C08J 7/18 (2006.01)

Patent

CA 2013587

ABSTRACT OF THE DISCLOSURE Disclosed is an oriented, heat-shrinkable, packaging film having a layer of polyamide or polyester. The film has a high shrink energy and high modulus. 5/890829.1/SPECFLDR 03/22/90

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

High shrink energy/high modulus thermoplastic multi-layer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High shrink energy/high modulus thermoplastic multi-layer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High shrink energy/high modulus thermoplastic multi-layer... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1408601

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.