High speed laser drilling machine and method

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 26/38 (2006.01) B23K 26/02 (2006.01) B23K 26/08 (2006.01) B23K 26/42 (2006.01) F01D 25/12 (2006.01)

Patent

CA 2621573

A method of laser drilling a series of holes at spaced-apart hole locations in a workpiece (18, 118, 218) including continually delivering laser pulses to the workpiece, and positioning the workpiece relative to the laser head (36, 136, 236) from one hole location to a next within a time between two consecutive pulses.

Cette invention concerne un procédé de perçage par laser d'une série de trous à des emplacements de trou espacés dans une pièce (18, 118, 218), lequel procédé consiste à appliquer en continu des impulsions laser sur la pièce et à changer la position de la pièce par rapport à la tête laser (36, 136, 236) entre un emplacement de trou et le suivant dans un intervalle compris entre deux impulsions consécutives.

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