High-speed rfid circuit placement method and device

G - Physics – 06 – K

Patent

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G06K 19/077 (2006.01)

Patent

CA 2581425

A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum (34) transfers chips or interposers (38) to a moving web (40) of electrical components (42) by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web.

L'invention concerne un procédé rapide qui consiste à enlever des puces ou des interposeurs d'une bande transporteuse présentant une première inclinaison et à transférer ces puces ou ces interposeurs sur des composants électroniques, tels que des structures d'antenne d'identification radiofréquence, sur une bande mobile présentant une seconde inclinaison. Selon un procédé, un tambour de transfert (34) transfère ces puces ou ces interposeurs (38) sur une bande mobile (40) de composants électroniques (42) en saisissant une puce lorsque le tambour de transfert est immobile et en transférant cette puce sur la bande mobile lorsque le tambour de transfert tourne, de façon qu'une vitesse tangentielle du tambour de transfert soit sensiblement égale à la vitesse linéaire de la bande mobile.

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